摘要: |
介绍了汽相再流焊的主要工艺特点,分析了汽相再流焊片式元件容易立碑的原因及控制方法,并对温度曲线加热因子与金属间化合物层厚度和焊点组织的关系进行了研究。 |
关键词: 汽相再流焊;温度曲线;立碑;加热因子;金属间化合物 |
基金项目: |
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Research of Vapor Phase Reflow Soldering Process Technology |
Wang Xiuli Ding Ying Yan Guisheng Yang Shujuan
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Beijing Institute of Control Engineering, Beijing 100190
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Abstract: |
This article describes the characteristic of vapor phase reflow soldering process. Then the causes of tombstoning when soldering chip components by the vapor phase reflow soldering is analyzed, and the controlling method is proposed. What’s more, this paper studies on the relationship between the heating factor of temperature profile and the thickness of inter-metallic compound layer and the microstructure of the solder joints. |
Key words: vapor phase reflow soldering;temperature profile;tombstoning;heating factor;inter-metallic compound |