摘要: |
针对SiCp/Al复合材料的特性,建立了二维铣磨加工有限元模型,研究了其在铣磨过程中,应力与温度的分布情况及铣磨力的变化规律。研究结果表明:加工过程中,Al基体与SiC颗粒分界面附近的应力值远高于其他部位,最先发生剪切破损;Al基体的加工温度扩散的也更为迅速;随着切削速度的上升,铣磨力均呈下降趋势;随着进给速度与径向切深的增加,铣磨力均呈上升趋势。 |
关键词: SiCp/Al;铣磨;有限元分析 |
基金项目: |
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Finite Element Analysis and Simulation of SiCp/Al Composites in Mill-grinding |
Chen Fengfan Wang Wei Liu Xiao
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Shanghai Aerospace Equipments Manufacture
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Abstract: |
A two-dimensional finite element model of mill-grinding was established according to the characteristics of SiCp/Al composites. The distribution of stress and temperature and the change law of force were studied during the mill-grinding. The results indicate that stress near the separatrix of Al and SiC particle is significantly higher than that of other positions, where shear failure occurs first; processing temperature of Al matrix diffuses faster than SiC particle; mill-grinding force declines with the cutting speed increasing, while increases with the feed speed and radial cutting depth increasing. |
Key words: SiCp/Al;mill-grinding;finite element analysis |