摘要: |
以BNi2为中间层,在不同的焊接参数下对TLP扩散焊IC10单晶与GH3039高温合金,以及IC10/BNi2/GH3039接头进行了微观组织及力学性能的分析。结果表明:焊接参数对接头界面组织的影响较为复杂,焊接温度的升高并不一定能够促进接头实现完全等温凝固,而保温时间的延长有助于接头实现完全等温凝固;1200℃/2h参数下的的接头常温拉伸强度达到736MPa,900℃高温拉伸强度达到220MPa,综合力学性能最好。 |
关键词: IC10;TLP;GH3039;微观组织;力学性能 |
基金项目: |
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Research on Microstructure and Mechanical Properties of TLP Bonded Joint of IC10/BNi2/GH3039 |
Xue Qing Li Yang Liu Zhenbo Zhao Junjing Dong Jiantao
Zhang Hongxu Wang Xuegang Yi Fan Li Xiuchun
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Capital Aerospace Machinery Company, Beijing 100076
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Abstract: |
This paper carries out the TLP welding research between crystal alloy IC10 and GH3039 super alloy with BNi2 as interlayer. The microstructure and mechanical properties of IC10/BNi2/GH3039 joints under different welding parameters are analyzed. Results indicate that the effects of welding parameters on the joint microstructure are complex. It is found that improving the welding temperature is not necessarily helpful to achieve isothermal solidification, while improving the holding time is helpful to achieve isothermal solidification. At the parameter of 1200℃/2h, the joint has the best comprehensive performance. The room temperature tensile strength is 736MPa and the 900℃ high-temperature tensile strength is 220MPa. |
Key words: IC10;TLP;GH3039;microstructure;mechanical properties |