摘要: |
分析了高密度、细间距板间电连接器的结构特点和装联技术难点,采用设计搪锡工装、改进电连接器的安装方式及工艺方法,解决了高密度、细间距板间电连接器的搪锡、插装及焊接等工艺瓶颈问题,总结出航天遥感器用高密度、细间距板间电连接器的装联工艺方法。 |
关键词: 板间对插;搪锡;插装;电连接器;装联 |
基金项目: |
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Assembly Methods of High-density Board to Board Interconnector forSpace Optical Remote Sensor |
Li Jiabin Qi Lin Du Shuang
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Beijing Institue of space Mechanics and Electricity, Beijing 100094
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Abstract: |
This paper analyzes the structural characteristics and the assembly difficulties of the high-density board to board interconnector. Designing tin tools, improving the installation way and preheating PCB are used to solve the lining tin, installation and welding problems. The assembly process methods of the high-density board to board interconnector are summarized for space optical remote sensor. |
Key words: board to board;tin pin;mounting;interconnector;assembly |