| 摘要: |
| 阐述了刚挠性印制电路板制造工艺技术在航空航天领域上的应用优势，介绍了刚挠性电路板的主要材料以及不同材料之间的性能比较；同时对刚挠结合板以及嵌入式挠性电路板的结构和制造工艺流程以及相应的优缺点进行了对比分析；讨论了刚挠性印制电路板技术的关键工艺问题以及未来发展趋势。 |
| 关键词: 刚挠性印制板 嵌入式挠性板 制造工艺 高密度互联 |
| 基金项目: |
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| Development Trend of Rigid Flex Printed Circuit Board Manufacturing Process Technology |
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Zhang Yukun Lai Linfang Bai Miao
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Beijing Institute of Space Mechanics and Electricity
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| Abstract: |
| The application advantages of rigid flexible printed circuit board manufacturing process technology in aerospace are expounded. The main materials of the flexible circuit board and the performance comparison between the different materials are introduced. At the same time, the structure and manufacturing process of the rigid flexure joint plate and the embedded flexible circuit board are compared and the advantages and disadvantages are compared. The key process problems of the rigid-flex printed circuit board technology and its future development trend are discussed at the end of this article. |
| Key words: rigid flexible printed circuit board embedded flexible circuit manufacturing process high density interface |
