摘要: |
介绍了功率芯片二次共晶工艺中焊料选型对共晶工艺的影响。通过对共晶后的试验件进行焊透率、剪切强度测试,试验结果发现使用In-15Pb-5Ag焊料和Sn-37Pb焊料进行二次共晶后的样品,其焊透率全部达到了90%以上,且剪切力均符合GJB548B“方法2019.2 芯片剪切强度”中的相关要求。 |
关键词: 二次共晶;焊透率;剪切强度 |
基金项目: |
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Study of High Soldering Area Ratio on Second Eutectic Soldering Process of Power Chip |
Hao Chengli WangXi Zha Jiahong Shao Mingkun
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Beijing Huahang Radio Measurement and Research Institute, Beijing 100013
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Abstract: |
In the present work, the effects of the type of solder on eutectic soldering process were given. The soldering area ratio and shear strength of the samples were tested. The result showed that the soldering area ratio of the samples after eutectic soldering with In-15Pb-5Ag or Sn-37Pb was up to 90%, and the shear strength measured up to the standards of die strength in GJB 548B. |
Key words: second eutectic soldering;soldering area ratio;shear strength |