摘要: |
介绍了印制板组件上大型QFP器件的灌封工艺技术。针对灌封要求,选用了合适的灌封材料。通过开展优化试验选择了最佳的灌封工艺参数,通过改进原灌封工艺方法解决了相应的关键技术难题,最终确定了合理的灌封工艺流程。根据灌封样品的试验结果,该灌封工艺技术满足印制板组件的设计要求。 |
关键词: 印制板组件;大型QFP器件;灌封工艺 |
基金项目: |
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Study on Potting Technology of Large-sized QFP Device on Printed Circuit Board Assembly |
Yang Xiaojian Ming Liwen Shen Li
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Beijing Institute of Computer Technology and Application, Beijing 100854
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Abstract: |
The potting technology of large-sized QFP device is described in details. The silicone gel was selected as potting material according to the characteristics of large-sized QFP device. The potting process parameters were selected by optimization test, the potting method was improved to solve the corresponding key technical problems of the potting process, and the reasonable potting process was determined. The experimental results of potting samples show that the potting technology is able to meet the design requirements for printed circuit board assembly. |
Key words: printed circuit board assembly;large-sized QFP device;potting technology |