摘要: |
介绍了印制板组件上BGA/CSP器件底部灌封工艺技术,针对灌封要求,通过实验及性能测试选择合适的底部灌封胶,研究了底部灌封工艺方法,确定合理工艺流程和各项操作技术要求,取得良好的效果,可有效提高产品在恶劣环境下工作稳定性及可靠性。 |
关键词: 印制板组件;BGA/CSP;灌封工艺 |
基金项目: |
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Study on Bottom Potting Technology of BGA/CSP Package on Printed Circuit Board Assembly |
Yang Xiaojian Zhao Xin Zhang Qi Shen Li
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Beijing Institute of Computer Technology and Application
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Abstract: |
The potting technology for BGA/CSP package is described in details. According to the potting requirements, the appropriate bottom potting adhesive is selected through experiments and performance tests. The operation method of bottom potting technology is studied, the reasonable process flow and various operation technical requirements are determined, good results are achieved, and the work stability and reliability of the product in the harsh environment are improved. |
Key words: printed circuit board assembly;BGA/CSP;potting technology |