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| 碳环氧蒙皮铝蜂窝夹心结构缺陷红外热波成像检测研究 |
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王 飞1,2, 岳卓言1,2, 刘俊岩1,2, 徐丽霞3, 刘丽霞3, 王 扬1, 陈明君1, 岳洪浩1
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1. 哈尔滨工业大学机电工程学院，哈尔滨 150001;2. 哈尔滨工业大学芜湖机器人产业技术研究院，;3. 北京卫星制造厂有限公司，北京 100094
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| 摘要: |
| 针对人造卫星碳环氧蒙皮铝蜂窝夹心结构承力筒典型缺陷对无损检测技术的迫切需求，提出采用正弦调制热流激励的红外锁相热波成像检测技术对该类型材料开展检测试验研究。建立了调制热流作用于材料的三维热波扩散模型，并采用有限元方法分析了缺陷尺度对热波特征的影响。研制了红外锁相热波成像检测系统，针对预制平顶孔模拟脱粘缺陷的碳环氧蒙皮铝蜂窝夹心结构开展试验研究。分析了调制参数与缺陷尺度对热波幅频-相频特性的影响。制定了红外锁相热波成像针对于碳环氧蒙皮蜂窝夹心结构缺陷识别判据，根据判据可得，锁相热波成像检测方法的相位特征可以准确识别大于等于Φ10mm的预制缺陷，同时当环氧板蒙皮厚度小于1.0mm时，可以识别Φ5mm的脱粘缺陷。 |
| 关键词: 红外锁相热波成像 热波扩散 脱粘缺陷 碳环氧蒙皮铝蜂窝夹心结构 无损检测 |
| 基金项目:博士后创新人才支持计划（BX2021092）；黑龙江省博士后科学基金（LBH-Z20019）；航空科学基金（2020Z05707700）；中国博士后科学基金（2021M690841）；哈尔滨工业大学芜湖机器人产业技术研究院产学研项目（HITCXYCMP2DDIRI2101）；国家自然科学基金（51174034）等 |
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| Research on Defects Detection of Carbon/Epoxy Skinned Aluminum Honeycomb Sandwich Structure Using Infrared Thermal-wave Imaging |
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Wang Fei1,2, Yue Zhuoyan1,2, Liu Junyan1,2, Xu Lixia3, Liu Lixia3, Wang Yang1, Cheng Mingjun1, Yue Honghao1
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1. Sch. Mechatronics Engineering, Harbin Institute of Technology, Harbin 150001;2. HIT Wuhu Robot Technology Research Institute, Wuhu 241000;3. Beijing Satellite Manufacturing Co., Ltd., Beijing 100094
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| Abstract: |
| In view of the urgent need for non-destructive testing for typical defects of artificial satellite carbon/epoxy skinned aluminum honeycomb sandwich structure bearing cylinders, infrared lock-in thermography is proposed to detect the typical defects in this present study. 3D thermal-wave diffusion model is established, and the effect of defect scale on thermal-wave characteristics is analyzed by finite element method. An infrared lock-in thermography detection system was developed, and an experimental study was carried out on the carbon/epoxy skinned aluminum honeycomb sandwich structure with debonding defects which simulated by flat bottom holes. The effects of modulation parameters and defect scales on the thermal-wave frequency-domain characteristics are analyzed. The infrared lock-in thermography is formulated for the defect identification criteria of carbon-epoxy skinned honeycomb sandwich structure. According to the criterion, the phase characteristics of the lock-in thermography can accurately detect the defect test materials greater than or equal to Φ10mm. Meanwhile, when the thickness of the carbon epoxy board is less than 1.0mm, the debonding defect of Φ5mm can be identified. |
| Key words: infrared lock-in thermography thermal-wave diffusion debonding defect carbon/epoxy skinned aluminum honeycomb sandwich structure nondestructive testing |
