| 摘要: |
| 随着航天器、国产大飞机及大尺寸无人飞行器等一批技术含量高、技术价值高及产业链地位高的新型高端装备持续发展，其核心电子信息模块亦随之呈现出产品集成化高、装配精度要求高及制造工艺流程复杂等新发展态势。作为电子制造的关键技术，这种新趋势给电子装联技术带来了新挑战和新发展。本文首先介绍目前电子装联技术面临的问题及挑战，继而从元器件电装技术优化、电装技术模块化优化及电装技术多元化衍变三个维度，遵循由点及面再到整体技术创新的逻辑系统地阐述了电子装联技术近年的发展情况，最后结合现状为电装技术未来的发展趋势提供了积极的思考与预测。 |
| 关键词: 元器件；印制板；印制板组件；电子装联 |
| 基金项目: |
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| The Current Development Status and Future Prospects of Electronic Assembly Technology for High-end Equipment |
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Zhou Zhou Ke Zipan He Riji Li Weiming He Xiao*
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The Fifth Research Institute of MIIT, Guangzhou 510610
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| Abstract: |
| With the gradual iteration and upgrading of high-end equipment in China towards informatization, digitization, and intelligence, the core electronic information modules of high-end equipment have also shown new development trends such as high product integration, high assembly accuracy requirements, and complex manufacturing processes. As a key technology in electronic fabrication, this new trend has brought new challenges and developments to electronic assembly technology. This article introduces the problems and challenges currently faced by electronic assembly technology firstly, and then systematically elaborates on the development of electronic assembly technology in recent years from three dimensions: optimization of electronic component assembly technology, modular optimization of electrical assembly technology, and diversified evolution of electrical assembly technology, from point to surface and then to overall technological innovation. Finally, combined with the current situation, it provides positive thinking and prediction for the future development trend of this technology. |
| Key words: components；PCB；PCBA；electronic assembly |
