| 摘要: |
| 针对无引线镀金表面贴装器件（如CLCC等封装类型器件）的手工智能焊台搪锡技术、手工锡锅搪锡技术、返修工作站搪锡技术进行了介绍和讨论，并比较了三种搪锡技术的性能特点，给出了适合无引线镀金表面贴装器件搪锡的最佳方案。 |
| 关键词: 无引线镀金表面贴装器件 搪锡技术 |
| 基金项目: |
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| Tin-lining Technology for Gold-plated Lead-free Surface Mount Devices |
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Wang Jilin Bai Lei Li Zhenzhen Yao Junhua
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Beijing Aerospace Times Optical-electronic Technology Co., Ltd., Beijing 100094
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| Abstract: |
| This paper introduces and discusses the Tin-lining technologies such as handcraft intelligent soldering station technology, handcraft tin pot technology and rework station technology for gold-plated lead-free surface mount devices (for example CLCC devices). The best proposal for Tin-lining of gold-plated lead-free surface mount devices is put forward by comparing the features of these three Tin-lining technologies. |
| Key words: gold-plated lead-free surface mount devices Tin-lining technology |
