| 摘要: |
| 介绍了航天器上无铅BGA器件的应用，重点介绍了无铅BGA器件的三种工艺焊接方法，通过工艺试验分析得出，三种方法都能较好地解决无铅器件的焊接问题。 |
| 关键词: 无铅器件 BGA 焊接 可靠性 |
| 基金项目: |
|
| Soldering Process Investigation on Lead Free BGA in Spacecraft |
|
Xu Weiling Yang Jing Li Jiabin
|
|
Beijing Institute of Space Mechanics and Electricity, Beijing 100076
|
| Abstract: |
| Application of lead free BGA on spacecraft is introduced in this paper. Three soldering methods of lead free BGA are introduced emphatically. All these methods can solve the soldering problems of lead free device through analysis of processing test. |
| Key words: lead free device BGA soldering reliability |
