摘要: |
阐述了选择性波峰焊技术的特点,并研究了选择性波峰焊的主要工艺参数。选择了试验板进行焊接,通过优化焊接工艺参数,可以有效避免焊点桥连、拉尖等缺陷的产生,对焊点进行X-Ray检查和金相分析,焊点透锡良好,微观组织均匀。 |
关键词: 选择性波峰焊;工艺参数;X-Ray;金相 |
基金项目: |
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Research of Selective Wave Soldering Process Technology |
Yan Guisheng Yang Shujuan Wang Xiuli Ding Ying Zhang Yanzhao
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Beijing Institute of Control Engineering, Beijing 100190
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Abstract: |
This article describes the characteristic of selective wave soldering process and studies the main process parameters. The soldering defects such as bridges and sharps can be avoided by optimizing the process parameters. The solder joints of the experimented printed board are inspected by X-Ray and microsection. The result shows that the solder filled in the hole, and the solder fillet is formed on the both sides of the PCB. The microstructure of the solder joints is uniform. |
Key words: selective wave soldering;process parameters;X-Ray;metallographic analysis |