| 摘要: |
| 介绍了再流焊过程中产生翘曲变形的原因，以及国内外研究人员对翘曲变形影响因素的研究。指出应以研制印制板工装夹具作为防止变形的重点。 |
| 关键词: 大尺寸印制板组件 再流焊 翘曲 工装夹具 |
| 基金项目: |
|
| Research on Technology Preventing Warpage Deformation of Large Area PCBAs |
|
Qi Lin Du Shuang Li Jiabin Lu Ming
|
|
Beijing Institute of Space Mechanics and Electricity
|
| Abstract: |
| The reasons and the affecting factors of warpage deformation are introduced. It is pointed that great emphasis should be placed on the research and development of the modular fixture for PCB. |
| Key words: large area PCB reflow soldering warpage deformation modular fixture |
