| 摘要: |
| 介绍了混装型印制板组件的通孔回流焊接工艺技术。首先选用可用于回流焊接的表贴和通孔器件制作试验板，继而开展了焊膏印刷模板优化设计和印刷工艺参数研究；采用预成型焊片进行焊锡量补偿的方法，解决了传统通孔回流焊接工艺中通孔器件焊点焊锡量不足的问题；明确了通孔器件的插装要求，合理设计了混装回流焊接工艺参数。完成了试验板的组装和焊接，形成的焊点形态良好，孔内焊料结晶组织均匀，填充率达到100%，焊点质量满足要求。 |
| 关键词: 通孔回流焊接 模板设计 焊片 焊膏量 |
| 基金项目: |
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| Study on Pin-through-hole Reflow Soldering Process of Mixed-mounting Printed Circuit Boards |
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Yang Xiaojian Shen Li Yu Dexue Zhang Qi
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Beijing Institute of Computer Technology and Application
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| Abstract: |
| The pin-through-hole reflow soldering process of mixed-mounting printed circuit boards is described in details. Firstly, the test board is made by using SMCs and THCs, and the optimum design of solder printing stencil and the study of printing process parameters are carried out. Then, the method of the solder perform for solder paste volume compensation is specially designed to solve the problem of insufficient quantity of through-hole solder joints in the traditional through-hole reflow soldering process. The requirements for the insertion of through-hole devices are clarified, and the process parameters of mixed reflow soldering are reasonably designed. The mixed-mounting printed circuit boards are completed with good shape joints, uniform crystal structure of the solder in the holes and 100% filling rate. The quality of soldering joints is up to the quality requirements. |
| Key words: pin-through-hole reflow soldering stencil design solder perform solder paste volume |
