摘要: |
在高速信号和热应力载荷作用下,球栅阵列封装(BGA)器件存在的焊点空洞大和焊接强度差等高发性缺陷,极易导致焊点破裂并引发器件故障。针对有铅焊球的BGA器件,通过真空汽相焊接技术从汽相液注入方式与升温速率之间的平衡规律入手,系统探讨了不同焊接阶段真空抽压以及调控真空度对焊点空洞的抑制机理。结果表明,在保温区真空度50mbar时BGA焊点具有较低的空洞率为0.9%,均匀的微观组织分布以及良好的焊接质量,可有效解决焊点空洞率过大而引发的可靠性问题。 |
关键词: 球栅阵列封装;真空汽相焊;真空度;空洞率 |
基金项目: |
|
Research on Vacuum Vapor Phase Soldering Technology of BGA Package Components with Low Void |
Wang Wenzhi Mao Haike Zhang Shaodong Xue Ping Qiu Jingping
|
Shanghai Aerospace Electronics Co., Ltd., Shanghai 201821
|
Abstract: |
Ball grid array (BGA) devices have been widely applied in aerospace electronic products. High-incidence defects such as solder joint void and poor soldering strength of BGA devices can easily lead to solder ball cracking and device failure under the action of high-speed signal and thermal stress load. For BGA devices with lead solder balls, vacuum vapor phase soldering technology is utilized to master the balance between the injected vapor phase liquid and heating rate. Moreover, the suppression mechanism of solder joint void via vacuum pumping at various soldering stages and adjusting the vacuum degree has been systematically investigated. The experimental results exhibit that such BGA device owns a lower void rate of 0.9%, more uniform microstructure distribution and better soldering quality under the soldering insulation zone with a vacuum degree of 50 mbar, which effectively solves the reliability caused by excessive void ratio of solder joints. |
Key words: ball grid array;vacuum vapor phase soldering;vacuum degree;void rate |