| 摘要: |
| 随着越来越多的电子元器件采用镀金焊盘，金脆现象成为影响产品质量的重点问题，针对LGA封装元器件的除金效率低、一致性差的瓶颈点，创新性地从工艺方法设计、工装设计、印刷、回流参数、整平方法和质量检验等几个方面探究了LGA封装元器件的相关电装工艺技术，提高LGA封装元器件除金质量和效率。 |
| 关键词: SMT LGA封装 航天制造 除金 |
| 基金项目: |
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| Application of Bulk Gold Removal Method of LGA Packaging Components in Aerospace Field |
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Bai Wenfeng1, Li Hang2, Wu Junxian2, Zhang Yuehui1
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1. Beijing Institute of Computer Technology and Application, Beijing 100854;2. The First Representative Office of Air Force Equipment Department in Beijing, Beijing 100070
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| Abstract: |
| With more and more electronic components using gold-plated pads, the phenomenon of gold embrittlement has become a key problem affecting product quality. Aiming at the bottleneck of low gold removal efficiency and poor consistency of LGA packaged components, the related electrical assembly technology of LGA packaged components is innovatively explored from process method design, tooling design, printing, reflow parameters, leveling method and quality inspection, so as to improve the gold removal quality and efficiency of LGA packaged components. |
| Key words: SMT LGA packaging aerospace manufacturing deduction |
