| 摘要: |
| 以固态发射机大功率芯片为研究对象，从自动共晶焊接专用吸嘴设计、大功率芯片载体表面可焊性、焊料片尺寸、焊接温度等方面研究了大功率芯片高精度自动共晶焊接工艺技术，测试了大功率芯片外观、空洞率、共晶焊接强度、共晶焊接精度。结果表明，使用合适的共晶焊接吸嘴、选取适宜的芯片焊接载体、采用优化尺寸的焊料片以及适宜的焊接参数完成焊接的大功率芯片，每个边长的75%以上有焊料溢出，焊接层总空洞率≤10%，有源区焊接层空洞率≤3%，剪切强度满足标准要求，自动共晶焊接精度优于15μm，实现了大功率芯片高精度、高可靠性自动共晶焊接工艺技术的应用。 |
| 关键词: 大功率芯片 高精度 共晶焊接工艺技术 |
| 基金项目: |
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| Research on High-precision Automatic Eutectic Soldering Process Technology of High-power Chip |
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Lan Yuanfei Ji Feng Jiao Qing Zhang Pengzhe Wang Daixing Zhang Xiaoyu Zheng Xiaohua
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Beijing Institute of Remote Sensing Equipment, Beijing 100854
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| Abstract: |
| Taking the high-power chip of solid-state transmitter as the research object, the high-precision automatic eutectic soldering technology of high-power chip is studied from the aspects of automatic eutectic soldering nozzle design, surface solderability of high-power chip carrier, solder chip size and soldering temperature. The appearance, void ratio, eutectic soldering strength and eutectic soldering accuracy of high-power chip are tested, the results show that more than 75% of each side length of high-power chip which is soldered by using appropriate eutectic soldering nozzle, selecting appropriate chip soldering carrier, using optimized solder chip and appropriate soldering parameters has solder overflow, total void rate of high-power chip soldering is less than or equal to 10%, the void rate of high-power chip active area soldering is less than or equal to 3%, the shear strength meets the standard requirements, the precision of automatic eutectic soldering is better than 15μm. The application of automatic eutectic soldering technology with high-precision and high reliability for high-power chip is achieved. |
| Key words: high-power chip high-precision eutectic soldering process technology |
