| 摘要: |
| 采用拉伸试验测量了电铸镍/锆铜高温下和经过热循环后的结合强度，利用扫描电子显微镜对断口表面形貌和经过高温或热循环后的试样组织进行观察。结果表明：经过高温后，电铸镍、电铸铜发生回复再结晶，晶粒由沿电铸方向的柱状晶转变为等轴晶，组织均匀化。电铸铜晶粒随温度升高长大。随着拉伸温度升高，电铸镍/锆铜结合强度下降，试样由穿晶断裂转变为沿晶断裂。经历最高温度在400℃及以下的热循环后，试样室温结合强度有小幅上升；经历最高温度在500℃及以上的热循环后，试样室温结合强度小幅下降。 |
| 关键词: 热作用 电铸镍 锆铜 组织 结合强度 |
| 基金项目: |
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| Thermal Effects on Microstructure and Bonding Strength of Electroformed Nickel/Zirconium Copper |
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Wang Xinyu,Fei Yunjun,Yue Haijin,Zou Hefei,Sun Hongbo,Zhao Yanhua,Zhao Yue,Wu Aiping
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1. State Key Laboratory of Tribology, Department of Mechanical Engineering, Tsinghua University, Beijing 100084;2. Capital Aerospace Machinery Co., Ltd., Beijing 100076
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| Abstract: |
| The bonding strength of electroformed nickel/zirconium copper at high temperature or after thermal cycle was measured by tensile test. Fracture surface morphology and microstructure after high temperature or thermal cycle were observed by scanning electron microscope. Results show that recrystallization of electroformed nickel and electroformed copper occurs after high temperature preservation, and grains transform from columnar along the electroforming direction to equiaxed while the microstructure was homogenized. The grain size of electroformed copper grows rapidly as temperature increases. With the increase of tensile temperature, the bonding strength of electroformed nickel/zirconium copper decreases, and the transgranular fracture changes to intergranular one. The room temperature bonding strength after thermal cycle increased slightly when the maximum temperature was below or equal to 400℃. Bonding strength decreased slightly when the maximum temperature was above or equal to 500℃. |
| Key words: thermal effects electroformed nickel zirconium copper microstructure bonding strength |
