低表面能材料灌封前处理工艺技术研究

刘智伟; 路  涛; 王晓敏; 范传强; 顾奋彪; 张志成

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低表面能材料灌封前处理工艺技术研究
刘智伟¹, 路涛², 王晓敏¹, 范传强¹, 顾奋彪¹, 张志成³
1. 中国空间技术研究院西安分院，西安 710100;2. 西安百瑞诺机电科技有限公司，西安 710000;3. 西安交通大学，西安 710000

摘要:

宇航高压电子产品中所用的聚酰亚胺（PI）等低表面能材料，因其表面光滑和亲水性差，导致其与灌封材料的粘接性能差，有必要进行灌封前处理。研究了碱液处理、等离子处理、底涂处理等改性方法的效果，最终确定了等离子处理结合底涂处理的方法，使聚酰亚胺表面与灌封材料的粘接性能得到显著提高。

关键词: 低表面能材料灌封前处理等离子处理

基金项目:

Technology Research on Pretreatment of Low Surface Energy Materials for Potting

Liu Zhiwei¹, Lu Tao², Wang Xiaomin¹, Fan Chuanqiang¹, Gu Fenbiao¹, Zhang Zhicheng³

1. China Academy of Space Technology (Xi’an), Xi’an 710100;2. Xi’an Bairuinuo Electromechanical Technnology Co., Ltd., Xi’an 710000;3. Xi’an Jiaotong University, Xi’an 710000

Abstract:

There are polimide and other low surface energy materials in aerospace high voltage electronic products. Due to their hydrophobic and smooth surfaces, it is poor adhesive to potting material. It is essential to pretreat polyimide surfaces before potting. The effect of alkali solution, plasma ombardment, primary coating for the surface modification of polyimide is discussed. Finally, a method of plasma ombardment and primary coating is determined, adhesion between polyimide and potting materials is enhanced by this modification method．

Key words: low surface energy materials potting pretreatment plasma ombardment